Ceramic electronic device

ABSTRACT

A ceramic electronic device includes multiple chip components and a pair of metal terminal portions. The chip components consist of a pair of chip end surfaces and four chip side surfaces. Terminal electrodes are formed on the pair of chip end surfaces. The pair of metal terminal portions is arranged correspondingly with the pair of chip end surfaces. Each of the pair of metal terminal portions includes an electrode face portion, multiple pairs of engagement arm portions, and a mount portion. The electrode face portion faces the chip end surface. The multiple pairs of engagement arm portions extend from the electrode face portion toward the chip side surface and sandwich and hold the chip components. The mount portion extends from one of terminal second sides toward the chip components and is partially substantially vertical to the electrode face portion.

BACKGROUND OF THE INVENTION 1. Field of the Invention

The present invention relates to a ceramic electronic device having achip component and a metal terminal attached thereto.

2. Description of the Related Art

In addition to a normal chip component that is solely directly mountedon a board or so, a chip component attached with a metal terminal isproposed as a ceramic electronic device, such as a ceramic capacitor. Itis reported that the ceramic electronic device attached with a metalterminal after being mounted has a reduction effect on a deformationstress that travels from a board to a chip component and a protectioneffect on a chip component from impacts or so. Thus, the ceramicelectronic device attached with a metal terminal is used in a fieldwhere durability, reliability, and the like are required.

It is also reported that a metal terminal has a prevention effect on avibration generated in the chip component from traveling to a mountboard. To enhance such an effect, it is proposed that a link portion bearranged between a mount portion and a connection portion (electrodeface portion) of the metal terminal.

Patent Document 1: JP 2015-95490 A

SUMMARY OF THE INVENTION

However, a conventional metal terminal with a link portion between amount portion and a connection portion (electrode face portion) has aproblem that a ceramic electronic device has a mount area (a projectedarea in the Z-axis direction) that is larger to some degree than aprojected area of a chip component.

The present invention has been achieved under such circumstances. It isan object of the invention to provide a ceramic electronic devicecapable of preventing a vibration generated in a chip component fromtraveling to a mount board via a metal terminal, protecting the chipcomponent from a deformation stress, an impact, and the like after beingmounted, and preventing a mount area from increasing.

To achieve the above object, the ceramic electronic device according tothe present invention is a ceramic electronic device comprising:

a plurality of substantially rectangular parallelepiped chip componentsconsisting of a pair of substantially rectangular chip end surfaceshaving a pair of chip first sides and a pair of chip second sides thatare shorter than the chip first sides and four chip side surfacesconnecting between the pair of chip end surfaces and provided withterminal electrodes formed on the pair of chip end surfaces; and

a pair of metal terminal portions arranged correspondingly with the pairof chip end surfaces,

wherein each of the pair of metal terminal portions comprises:

a substantially rectangular flat electrode face portion having a pair ofterminal first sides substantially parallel to the chip first sides anda pair of terminal second sides substantially parallel to the chipsecond sides and facing the chip end surface;

a plurality of pairs of engagement arm portions extending from theelectrode face portion toward the chip side surface and sandwiching andholding the chip components from both ends of the chip first sides; and

a mount portion connected with one of the terminal second sides of theelectrode face portion, extending from one of the terminal second sidestoward the chip components, and being at least partially substantiallyvertical to the electrode face portion.

In the metal terminal portions of the ceramic electronic deviceaccording to the present invention, the ceramic electronic device has aheight direction that is the same direction as the chip first sides,which are longer sides of the chip end surfaces. Thus, the ceramicelectronic device according to the present invention has a smallprojected area in the height direction. Since the mount portion isconnected with the terminal second side, the ceramic electronic deviceaccording to the present invention can have a small projected area inthe height direction and further reduce a mount area compared to priorarts where the mount portion is connected with the terminal first sidesvia a connection portion.

In the metal terminal portions of the ceramic electronic deviceaccording to the present invention, a height direction of the ceramicelectronic device is the same as directions of the longer sides of thechip end surfaces, and the mount area is thereby prevented fromincreasing even in a structure where the plurality of chip components isnot laminated in the height direction but is arranged side by side in aparallel direction to the mount surface. In the structure where theplurality of chip components is arranged side by side in a paralleldirection to the mount surface, such a ceramic electronic device has anunchangeable mount height even if the number of chip components changesand is thereby suitable for being mounted on a mount board used fordevices with severe demands on low profile. In the ceramic electronicdevice with the structure where the plurality of chip components isarranged side by side in a parallel direction to the mount surface,since only one chip component is held between a pair of the engagementarm portions along an engagement direction, a connection reliabilitybetween the chip components and the metal terminal portions is high, anda high reliability for impact and vibration is obtained. The metalterminal portions, where the pair of engagement arm portions holds onlyone chip component along the engagement direction, can definitely holdthe chip components even if the chip components have long first sides.

In the ceramic electronic device according to the present invention, theengagement arm portions sandwich and hold the chip components from bothends of the first sides, and the metal terminal portions can therebyeffectively demonstrate a reduction effect on stress, reduce atransmission of vibration from the chip components to the mount board,and prevent an acoustic noise.

For example, the chip components may be a multilayer capacitor whereinternal electrode layers and dielectric layers are laminated, and

the chip components may have a lamination direction that issubstantially parallel to the chip second sides.

In the ceramic electronic device, the internal electrode layers arearranged vertically to the mount surface, and ESL can be thereby loweredcompared to when internal electrode layers are arranged in parallel to amount surface. The chip first sides held by the engagement arm portionsare vertical to the lamination direction, and the ceramic electronicdevice thereby has a small size dispersion. Thus, the metal terminalportions can more definitely hold the chip components by holding a partof the chip components having a small size dispersion.

For example, a first through hole may be formed in a part of theelectrode face portion facing the chip end surfaces.

For example, a solder, a conductive adhesive, or the like thatelectrically and mechanically connects the chip components and the metalterminal portions can be applied after the metal terminal portions andthe chip components are assembled, and the ceramic electronic devicewith the first through hole can be thereby manufactured easily. A stateof the connection member electrically and mechanically connecting thechip components and the metal terminals can be recognized from outsidethe ceramic electronic device, and no manufacturing defect can bethereby generated.

For example, the electrode face portion may be provided with a pluralityof protrusions protruding toward the chip end surfaces and touching thechip end surfaces.

The protrusions formed on the electrode face portion reduce an areawhere the electrode face portion and the chip end surfaces are directlyin contact with. Thus, a vibration of the chip components can beprevented from traveling to the mount board, and an acoustic noise ofthe ceramic electronic device can be prevented. The protrusions form aspace between the electrode face portion and the chip end surfaces. Itis thereby possible to control a state of the connection memberelectrically and mechanically connecting the chip components and themetal terminal portions and favorably control the connection statebetween the chip components and the metal terminal portions.

For example, the electrode face portion may be provided with a secondthrough hole whose periphery portion is connected with a lower armportion that is one of the plurality of engagement arm portions.

The vicinity of the lower arm portion supporting the chip component hasan easily deformable shape, and the metal terminal portions with thesecond through hole can thereby effectively demonstrate a reductioneffect on a stress generated in the ceramic electronic device and anabsorption effect on a vibration of the chip component. Thus, theceramic electronic device having the metal terminal portions canfavorably prevent an acoustic noise and have a favorable connectionreliability with a mount board when being mounting.

For example, an upper arm portion that is another one of the pluralityof engagement arm portions may be connected with the other terminalsecond side of the electrode face portion, and

the upper arm portion and the lower arm portion may sandwich the chipcomponent from both ends of the terminal first sides.

In the metal terminals with the mount portion connected with one of theterminal second sides and the upper arm portion connected with the otherchip second side, a height direction (terminal first side direction) canbe short, and the ceramic electronic device with the metal terminalportions is advantageous in low profile. In the metal terminal portions,the lower arm portion is not connected with the terminal second sides,and the upper and lower arm portions and the mount portion can bethereby formed at positions that are overlapped in the terminal secondside direction. Thus, the ceramic electronic device is advantageous indownsizing.

For example, the electrode face portion may comprise:

a plate body part facing the chip end surfaces; and

a terminal connection part positioned below the plate body part andconnecting between the plate body part and the mount portion,

the second through hole may be formed so that the periphery portion ofthe second through hole mounts the plate body part and the terminalconnection part, and

the lower arm portion may extend from the terminal connection part.

When the lower arm portion extends from the terminal connection part,the ceramic electronic device has a short transmission path between theterminal electrodes and the mount board, compared to when the lower armportion is connected with the plate body part.

For example, the electrode face portion may be provided with a firstthrough hole and a second through hole having a periphery portionconnected with a lower arm portion that is one of the plurality ofengagement arm portions and positioned closer to the mount portion thanthe first through hole, and

an opening width of the second through hole in a width direction that isa parallel direction to the terminal second sides may be wider than thatof the first through hole.

The first through hole and the second through hole have any openingwidth in the width direction, but when the second through hole has alarger opening width, the metal terminal portion can effectively enhancea reduction effect on stress and a prevention effect on acoustic noise.When the first through hole has an opening width that is narrower thanan opening width of the second through hole, a connection strengthbetween the chip components and the electrode face portion using theconnection member or so can be prevented from being excessively high,and such a ceramic electronic device can prevent an acoustic noise.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic perspective view showing a ceramic electronicdevice according to First Embodiment of the present invention.

FIG. 2 is a front view of the ceramic electronic device shown in FIG. 1.

FIG. 3 is a left side view of the ceramic electronic device shown inFIG. 1.

FIG. 4 is a top view of the ceramic electronic device shown in FIG. 1.

FIG. 5 is a bottom view of the ceramic electronic device shown in FIG.1.

FIG. 6 is a schematic cross sectional view of the ceramic electronicdevice shown in FIG. 1.

FIG. 7 is a schematic perspective view showing a ceramic electronicdevice according to Second Embodiment of the present invention.

FIG. 8 is a front view of the ceramic electronic device shown in FIG. 7.

FIG. 9 is a left side view of the ceramic electronic device shown inFIG. 7.

FIG. 10 is a top view of the ceramic electronic device shown in FIG. 7.

FIG. 11 is a bottom view of the ceramic electronic device shown in FIG.7.

FIG. 12 is a left side view of a ceramic electronic device according toFirst Variation.

FIG. 13 is a left side view of a ceramic electronic device according toSecond Variation.

FIG. 14 is a perspective view of a ceramic capacitor according toComparative Example.

FIG. 15 is a graph showing measurement results of impedance andresistance component of ceramic capacitors according to Example andComparative Example.

DESCRIPTION OF THE PREFERRED EMBODIMENTS

Hereinafter, embodiments of the present invention are described based onfigures.

First Embodiment

FIG. 1 is a schematic perspective view showing a ceramic capacitor 10according to First Embodiment of the present invention. The ceramiccapacitor 10 has chip capacitors 20 as chip components and a pair ofmetal terminal portions 30 and 40. The ceramic capacitor 10 according toFirst Embodiment has the two chip capacitors 20, but the ceramiccapacitor 10 has any plural chip capacitors 20.

Incidentally, each embodiment is described with a ceramic capacitorwhere the chip capacitors 20 are equipped with the metal terminalportions 30 and 40, but the ceramic electronic device of the presentinvention is not limited to the ceramic capacitor, and may be a chipcomponent other than capacitors equipped with the metal terminalportions 30 and 40. In the description of each embodiment, as shown inFIG. 1 to FIG. 11, the X-axis direction is a direction where first sidesurfaces 20 c and second side surfaces 20 d of the chip capacitors 20are connected (a parallel direction to chip second sides 20 h), theY-axis is a direction where first end surfaces 20 a and second endsurfaces 20 b are connected (a parallel direction to chip third sides 20j), and the Z-axis direction is a direction where third side surfaces 20e and fourth side surfaces 20 f are connected (a parallel direction tochip first sides 20 g).

The chip capacitors 20 have an approximately rectangular parallelepipedshape, and each of the two chip capacitors 20 has approximately the sameshape and size. As shown in FIG. 2, the chip capacitors 20 have a pairof chip end surfaces facing each other, and the pair of chip endsurfaces consists of the first end surface 20 a and the second endsurface 20 b. As shown in FIG. 1, FIG. 2, and FIG. 4, the first endsurfaces 20 a and the second end surfaces 20 b have an approximatelyrectangular shape. In four sides constituting the rectangulars of thefirst end surfaces 20 a and the second end surfaces 20 b, a pair oflonger sides is chip first sides 20 g (see FIG. 2), and a pair ofshorter sides is chip second sides 20 h (see FIG. 3).

The chip capacitors 20 are arranged so that the first end surfaces 20 aand the second end surfaces 20 b are vertical to a mount surface, inother words, the chip third sides 20 j of the chip capacitors 20connecting between the first end surfaces 20 a and the second endsurfaces 20 b are parallel to the mount surface of the ceramic capacitor10. Incidentally, the mount surface of the ceramic capacitor 10 is asurface attached with the ceramic capacitor 10 by solder or so andfacing mount portions 38 and 48 of the metal terminal portions 30 and 40mentioned below.

When comparing a length L1 of the chip first side 20 g shown in FIG. 2and a length L2 of the chip second side 20 h shown in FIG. 4, the chipsecond side 20 h is shorter than the chip first side 20 g (L1>L2). Thechip first side 20 g and the chip second side 20 h have any lengthratio, but L2/L1 is about 0.3 to 0.7, for example.

The chip capacitors 20 are arranged so that the chip first sides 20 gare vertical to the mount surface as shown in FIG. 2, and that the chipsecond sides 20 h are parallel to the mount surface as shown in FIG. 4.In the first to fourth side surfaces 20 c to 20 f, which are the fourchip side surfaces connecting the first end surfaces 20 a and the secondend surfaces 20 b, the first and second side surfaces 20 c and 20 d,whose areas are large, are arranged vertically to the mount surface, andthe third and fourth side surfaces 20 e and 20 f, whose areas aresmaller than those of the first and second side surfaces 20 and 20 d,are arranged in parallel to the mount surface. The third side surfaces20 e are upper side surfaces facing the opposite direction to the mountportions 38 and 48 below, and the fourth sides surfaces 20 f are lowerside surfaces facing the mount portions 38 and 48.

As shown in FIG. 1, FIG. 2, and FIG. 4, first terminal electrodes 22 ofthe chip capacitors 20 are formed to reach from the first end surfaces20 a to a part of the first to fourth side surfaces 20 c to 20 f Thus,the first terminal electrode 22 has a part arranged on the first endsurface 20 a and a part arranged on the first to fourth side surfaces 20c and 20 f.

The second terminal electrodes 24 of the chip capacitors 20 are formedto reach from the second end surfaces 20 b to another part of the firstto fourth side surfaces 20 c to 20 f (a different part from the partwhere the first terminal electrodes 22 reach). Thus, the second terminalelectrode 24 has a part arranged on the second end surface 20 b and apart arranged on the first to fourth side surfaces 20 c to 20 f (seeFIG. 1, FIG. 2, and FIG. 4). The first terminal electrodes 22 and thesecond terminal electrodes 24 are arranged with a predetermined distanceon the first to fourth side surfaces 20 c to 20 f.

As shown in FIG. 6, which schematically shows internal structures of thechip capacitors 20, the chip capacitors 20 are a multilayer capacitorwhere internal electrode layers 26 and dielectric layers 28 arelaminated. In the internal electrode layers 26, internal electrodelayers 26 connected with the first terminal electrodes 22 and internalelectrode layers 26 connected with the second terminal electrodes 24 arelaminated alternately by sandwiching the dielectric layers 28.

As shown in FIG. 6, the chip capacitors 20 have a lamination directionthat is parallel to the chip second sides 20 h shown in FIG. 4. Thus,the internal electrode layers 26 shown in FIG. 6 are arranged verticallyto the mount surface.

The dielectric layers 28 of the chip capacitors 20 are composed of anydielectric material, such as calcium titanate, strontium titanate,barium titanate, and a mixture thereof. Each of the dielectric layers 28has any thickness, but normally has a thickness of several μm to severalhundred μm. In the present embodiment, each of the dielectric layers 28preferably has a thickness of 1.0 to 5.0 μm. The dielectric layers 28preferably have a main component of barium titanate, which can increasecapacitance of capacitors.

The internal electrode layers 26 contain any conductive material, butmay contain a comparatively inexpensive base metal when the dielectriclayers 28 are composed of a reduction resistant material. The base metalis preferably Ni or a Ni alloy. The Ni alloy is preferably an alloy ofNi and one or more elements of Mn, Cr, Co, and Al, and preferablycontains Ni at 95 wt % or more. Incidentally, Ni or the Ni alloy maycontain various fine components, such as P, at about 0.1 wt % or less.The internal electrode layers 26 may be formed using a commerciallyavailable electrode paste. Each of the internal electrode layers 26 hasa thickness appropriately determined based on usage or so.

The first and second terminal electrodes 22 and 24 are also composed ofany material. The first and second terminal electrodes 22 and 24 arenormally composed of copper, copper alloy, nickel, nickel alloy, or thelike, but may be composed of silver, an alloy of silver and palladium.Each of the first and second terminal electrodes 22 and 24 also has anythickness, but normally has a thickness of about 10 to 50 μm.Incidentally, at least one metal film of Ni, Cu, Sn, etc. may be formedon the surfaces of the first and second terminal electrodes 22 and 24.

The chip capacitors 20 have shape and size that are appropriatelydetermined based on object and usage. For example, the chip capacitor 20has a length (L3) of 1.0 to 6.5 mm, preferably 3.2 to 5.9 mm, a width(L1) of 0.5 to 5.5 mm, preferably 1.6 to 5.2 mm, and a thickness (L2) of0.3 to 3.2 mm, preferably 0.8 to 2.9 mm. When the ceramic capacitor 10has a plurality of the chip capacitors 20, each of the chip capacitors20 may have mutually different size and shape.

A pair of the metal terminal portions 30 and 40 of the ceramic capacitor10 is arranged correspondingly with the first and second end surfaces 20a and 20 b, which are a pair of chip end surfaces. That is, the firstmetal terminal portion 30, which is one of the pair of the metalterminal portions 30 and 40, is arranged correspondingly with the firstterminal electrodes 22, which are one of the pair of the terminalelectrodes 22 and 24, and the second metal terminal portion 40, which isthe other of the pair of the metal terminal portions 30 and 40, isarranged correspondingly with the second terminal electrodes 24, whichare the other of the pair of the terminal electrodes 22 and 24.

The first metal terminal portion 30 has an electrode face portion 36, aplurality of pairs of engagement arm portions 31 a, 31 b, 33 a, and 33b, and a mount portion 38. The electrode face portion 36 faces the firstterminal electrodes 22. The engagement arm portions 31 a, 31 b, 33 a,and 33 b sandwich and hold the chip capacitors 20 from both ends of thechip first sides 20 g in the Z-axis direction. The mount portion 38extends from the electrode face portion 36 toward the chip capacitors 20and is at least partially approximately vertical to the electrode faceportion 36.

As shown in FIG. 2, the electrode face portion 36 has a substantiallyrectangular flat shape having a pair of terminal first sides 36 gapproximately parallel to the chip first sides 20 g vertical to themount surface and a pair of terminal second sides 36 ha and 36 hbapproximately parallel to the chip second sides 20 h approximatelyparallel to the mount surface as shown in FIG. 3.

As shown in FIG. 3 and FIG. 12, which is about First Variation, theterminal second sides 36 ha and 36 hb parallel to the mount surface havea length that may be equal to, slightly shorter, or slightly longer thana length obtained by multiplying a length L2 of the chip second side 20h arranged in parallel to the terminal second sides 36 ha and 36 hb andthe number of the chip capacitors 20 contained in the ceramic capacitor10 or 200.

For example, a ceramic capacitor 200 according to First Variation shownin FIG. 12 includes two chip capacitors, and terminal second sides 36 haand 36 hb parallel to a mount surface have a length that is shorter thana double of a length L2 of a chip second side 20 h arranged in parallelto the terminal second sides 36 ha and 36 hb. Incidentally, the ceramiccapacitor 200 is the same as the ceramic capacitor 10 shown in FIG. 1 toFIG. 7 except that the chip second sides of the chip capacitors have alength that is longer than the chip second sides 20 h of the chipcapacitors 20 according to the embodiment.

On the other hand, the ceramic capacitor 10 according to FirstEmbodiment shown in FIG. 3 includes two chip capacitors, and theterminal second sides 36 ha and 36 hb parallel to the mount surface havea length that is slightly longer than a double of a length L2 of thechip second side 20 h arranged in parallel to the terminal second sides36 ha and 36 hb. As shown in FIG. 3 and FIG. 12, a chip capacitor thatcan be combined with the metal terminals 30 and 40 does not have onlyone size, and the metal terminals 30 and 40 can constitute a ceramiccapacitor correspondingly with multiple kinds of chip capacitors havingchip second sides whose lengths are different from each other.

The electrode face portion 36 is electrically and mechanically connectedwith the first terminal electrodes 22 formed on the first end surfaces20 a facing the electrode face portion 36. For example, the electrodeface portion 36 and the first terminal electrodes 22 can be connectedwith each other by arranging a conductive connection member, such as asolder and a conductive adhesive, in a space between the electrode faceportion 36 and the first terminal electrodes 22 shown in FIG. 4.Incidentally, when the first metal terminal portion 30 and the firstterminal electrodes 22 are connected electrically by contact portionsbetween the engagement arm portions 31 a, 31 b, 33 a, and 33 b mentionedbelow and the first terminal electrodes 22, connection members betweenthe electrode face portion 36 and the first terminal electrodes 22 maybe a non-conductive adhesive or so, such as an epoxy resin and a phenolresin.

First through holes 36 b are formed on a part of the electrode faceportion 36 facing the first end surfaces 20 a. Two first through holes36 b are formed correspondingly with the chip capacitors 20 contained inthe ceramic capacitor 10, but any shape and number of the first throughholes 36 b are formed.

The first through holes 36 b is provided with connection membersconnecting between the electrode face portion 36 and the first terminalelectrodes 22. The connection members are preferably composed of aconductive material, such as a solder and a conductive adhesive. Forexample, a connection member composed of a solder forms a solder bridgebetween a periphery of the first through hole 36 b and the firstterminal electrode 22, and the electrode face portion 36 and the firstterminal electrode 22 can be thereby joined strongly.

The electrode face portion 36 is provided with a plurality ofprotrusions 36 a protruding toward the first end surfaces 20 a of thechip capacitors 20 and touching the first end surfaces 20 a. Theprotrusions 36 a reduce a contact area between the electrode faceportion 36 and the first terminal electrodes 22. This makes it possibleto prevent a vibration generated in the chip capacitors 20 fromtraveling to the mount board via the first metal terminal portion 30 andprevent an acoustic noise of the ceramic capacitor 10.

A range where a connection member, such as a solder, is formed can beadjusted by forming the protrusions 36 a around the first through holes36 b. In such a ceramic capacitor 10, an acoustic noise can be preventedwhile a connection strength between the electrode face portion 36 andthe first terminal electrodes 22 is appropriately adjusted in anappropriate range. Incidentally, four protrusions 36 a are formed aroundone first through hole 36 b in the ceramic capacitor 10, but any numberand arrangement of the protrusions 36 a are employed.

The electrode face portion 36 is provided with second through holes 36 chaving a periphery portion connected with the lower arm portion 31 b or33 b, which is one of multiple pairs of the engagement arm portions 31a, 31 b, 33 a, and 33 b. The second through holes 36 c are positionedcloser to the mount portion 38 than the first through holes 36 b. Unlikethe first through holes 36 b, the second through holes 36 c are notprovided with any connection member, such as a solder.

The vicinities of the lower arm portions 31 b and 33 b supporting thechip capacitors 20 have an easily deformable shape, and the first metalterminal portion 30 with the second through holes 36 c can therebyeffectively demonstrate a reduction effect on a stress generated in theceramic capacitor 10 and an absorption effect on a vibration of the chipcapacitors 20. Thus, the ceramic capacitor 10 having the first metalterminal portion 30 can favorably prevent an acoustic noise and have afavorable connection reliability with the mount board wen being mounted.

The second through holes 36 c have any shape, but preferably have anopening width in the width direction, which is a parallel direction(X-axis direction) to the terminal second sides 36 ha and 36 hb, that iswider than the first through holes 36 b. When the second through holes36 c have a wide opening width, the first metal terminal portion 30 caneffectively enhance a reduction effect on stress and a prevention effecton acoustic noise. When the first through holes 36 b have an openingwidth that is narrower than an opening width of the second through holes36 c, a connection strength between the chip capacitors 20 and theelectrode face portion 36 is prevented from being too strong due to anexcessively scattered connection member, and such a ceramic capacitor 10can prevent an acoustic noise.

In the electrode face portion 36, the second through hole 36 c connectedwith the lower arm portion 31 b is formed with a predetermined distancein the height direction against the terminal second side 36 hb belowconnected with the mount portion 38, and a slit 36 d is formed betweenthe second through hole 36 c and the terminal second side 36 hb. In theelectrode face portion 36, the slit 36 d is formed between a connectionposition of the lower arm portion 31 b positioned near the mount portion38 with the electrode face portion 36 (a lower side of a peripheryportion of the second through hole 36 c) and the terminal second side 36hb below connected with the mount portion 38. The slits 36 d extend in aparallel direction to the terminal second sides 36 ha and 36 hb. Theslits 36 d can prevent a solder used at the time of mounting the ceramiccapacitor 10 on a mount board from creeping up on the electrode faceportion 36 and prevent a formation of a solder bridge connected with thelower arm portions 31 b and 33 b or the first terminal electrodes 22.Thus, the ceramic capacitor 10 with the slits 36 d demonstrates aprevention effect on acoustic noise.

As shown in FIG. 1 and FIG. 2, the engagement arm portions 31 a, 31 b,33 a, and 33 b of the first metal terminal portion 30 extend from theelectrode face portion 36 to the third or fourth side surfaces 20 e or20 f, which are chip side surfaces of the chip capacitors 20. The lowerarm portion 31 b (or lower arm portion 33 b), which is one of theengagement arm portions 31 a, 31 b, 33 a, and 33 b, is connected withthe periphery portion of the second through hole 36 c formed on theelectrode face portion 36. The upper arm portion 31 a (or upper armportion 33 a), which is another one of the engagement arm portions 31 a,31 b, 33 a, and 33 b, is connected with the terminal second side 36 haat the upper part of the electrode face portion 36 (positive side of theZ-axis direction).

As shown in FIG. 1, the electrode face portion 36 has a plate body part36 j and a terminal connection part 36 k. The plate body part 36 j facesthe first end surfaces 20 a of the chip capacitors 20 and is positionedat a height overlapping with the first end surfaces 20 a. The terminalconnection part 36 k is positioned below the plate body part 36 j andconnects between the plate body part 36 j and the mount portion 38. Thesecond through holes 36 c are formed so that their periphery portionsrange the plate body part 36 j and the terminal connection part 36 k.The lower arm portions 31 b and 33 b extend from the terminal connectionpart 36 k. That is, bases of the lower arm portions 31 b and 33 b areconnected with lower sides of approximately rectangular peripheryportions of the second through holes 36 c, and the lower arm portions 31b and 33 b extend from their bases toward above (positive side of theZ-axis direction) and inside (negative side of the Y-axis direction)while being bent, touch the fourth side surfaces 20 f of the chipcapacitors 20, and support the chip capacitors 20 from below (see FIG.2). Thus, lower edges (chip second sides 20 h below) of the first endsurfaces 20 a of the chip capacitors 20 are positioned above the lowersides of the periphery portions of the second through holes 36 c, whichare the bases of the lower arm portions 31 b and 33 b. When viewing thechip capacitors 20 from the positive side of the Y-axis direction asshown in FIG. 3, the lower edges (chip second sides 20 h below) of thefirst end surfaces 20 a of the chip capacitors 20 can be recognized fromthe side of the ceramic capacitor 10 via the second through holes 36 b.

As shown in FIG. 1, a pair of the upper arm portion 31 a and lower armportion 31 b holds one chip capacitor 20, and a pair of the upper armportion 33 a and lower arm portion 33 b holds another one chip capacitor20. Since a pair of the upper arm portion 31 a and the lower arm portion31 b (or the upper arm portion 33 a and lower arm portion 33 b) holdsone chip capacitor 20, not multiple chip capacitors 20, the first metalterminal portion 30 can definitely hold each of the chip capacitors 20.A pair of the upper arm portion 31 a and lower arm portion 31 b does nothold the chip capacitor 20 from both ends of the chip second sides 20 h,which are shorter sides of the first end surface 20 a, but holds thechip capacitor 20 from both ends of the chip first sides 20 g, which arelonger sides. This increases distances between the upper arm portions 31a and 33 a and the lower arm portions 31 b and 33 b, and easily absorbsa vibration of the chip capacitors 20. Thus, the ceramic capacitor 10can favorably prevent an acoustic noise.

Incidentally, a pair of the upper arm portion 31 a and the lower armportion 31 b holding the chip capacitor 20 may have mutually asymmetryshapes and mutually different lengths in the width direction (lengths inthe X-axis direction). Since the lower arm portions 31 b and 33 b extendfrom the terminal connection part 36 k, the chip capacitors 20 have ashort transmission path between the first terminal electrodes 22 and themount board, compared to when the lower arm portions 31 b and 33 b areconnected with the plate body part 36 j.

The mount portion 38 is connected with the terminal second side 36 hbbelow in the electrode face portion 36. The mount portion 38 extendsfrom the terminal second side 36 hb below toward the chip capacitors 20(negative side of the Y-axis direction) and is bent approximatelyvertically to the electrode face portion 36. Incidentally, the topsurface of the mount portion 38, which is a surface of the mount portion38 closer to the chip capacitors 20, preferably has a solder wettabilitythat is lower than a solder wettability of the bottom surface of themount portion 38 in order to prevent an excessive scattering of a solderused when the chip capacitors 20 are mounted on a board.

The mount portion 38 of the ceramic capacitor 10 is mounted on a mountsurface, such as a mount board, in a position facing downward as shownin FIG. 1 and FIG. 2. Thus, a height of the ceramic capacitor 10 in theZ-axis direction is a height of the ceramic capacitor 10 when beingmounted. In the ceramic capacitor 10, the mount portion 38 is connectedwith the terminal second side 36 hb on one side of the electrode faceportion 36, and the upper arm portions 31 a and 33 a are connected withthe terminal second side 36 ha on the other side of the electrode faceportion 36. Thus, the ceramic capacitor 10 has no unnecessary part ofthe length in the Z-axis direction and is advantageous in reducing itsheight.

Since the mount portion 38 is connected with the terminal second side 36hb on one side of the electrode face portion 36, the ceramic capacitor10 can have a small projected area in the Z-axis direction and have asmall mount area, compared to prior arts where the mount portion 38 isconnected with the terminal first sides 36 g of the electrode faceportion 36. Since the third and fourth side surfaces 20 e and 20 fhaving small areas of the first to fourth side surfaces 20 c to 20 f ofthe chip capacitors 20 are arranged in parallel to the mount surface,the ceramic capacitor 10 can have a small mount area even if the chipcapacitors 20 are not overlapped with each other in the heightdirection.

As shown in FIG. 1 and FIG. 2, the second metal terminal portion 40 hasan electrode face portion 46, a plurality of pairs of engagement armportions 41 a, 41 b, and 43 a, and a mount portion 48. The electrodeface portion 46 faces the second terminal electrodes 24. The engagementarm portions 41 a, 41 b, 43 a, and 43 b sandwich and hold the chipcapacitors 20 from both ends of the chip first sides 20 g in the Z-axisdirection. The mount portion 48 extends from the electrode face portion46 toward the chip capacitors 20 and is at least partially approximatelyvertical to the electrode face portion 46.

As is the case with the electrode face portion 36 of the first metalterminal portion 30, the electrode face portion 46 of the second metalterminal portion 40 has a pair of terminal first sides 46 gapproximately parallel to the chip first sides 20 g and a terminalsecond side 46 ha approximately parallel to the chip second sides 20 h.The electrode face portion 46 is provided with protrusions 46, firstthrough holes, second through holes, and slits 46 d. As shown in FIG. 1,the second metal terminal portion 40 is arranged symmetrically to thefirst metal terminal portion 30, and is different from the first metalterminal portion 30 in arrangement against the chip capacitors 20. Thesecond metal terminal portion 40 is, however, different from the firstmetal terminal portion 30 only in arrangement against the chipcapacitors 20 and has a similar shape to the first metal terminalportion 30. Thus, the second metal terminal portion 40 are not describedin detail.

The first metal terminal portion 30 and the second metal terminalportion 40 are composed of any conductive metal material, such as iron,nickel, copper, silver, and an alloy thereof. In particular, the firstand second metal terminal portions 30 and 40 are preferably composed ofphosphor bronze in consideration of restraining resistivity of the firstand second metal terminal portions 30 and 40 and reducing ESR of theceramic capacitor 10.

Hereinafter, a manufacturing method of the ceramic capacitor 10 isdescribed.

Manufacturing Method of Multilayer Ceramic Chip Capacitor 20

In a manufacture of the multilayer ceramic chip capacitor 20, alaminated body is prepared by laminating green sheets (to be thedielectric layers 28 after firing) with electrode patterns to be theinternal electrode layers 26 after firing, and a capacitor element bodyis obtained by pressurizing and firing the obtained laminated body.Moreover, the first and second terminal electrodes 22 and 24 are formedon the capacitor element body by baking and plating a terminal electrodepaint, and the chip capacitor 20 is thereby obtained. A green sheetpaint and an internal electrode layer paint, which are raw materials ofthe laminated body, a raw material of the terminal electrodes, firingconditions of the laminated body and the electrodes, and the like arenot limited, and can be determined with reference to known manufacturingmethods or so. In the present embodiment, ceramic green sheets whosemain component is barium titanate are used as a dielectric material. Inthe terminal electrodes, a Cu paste is immersed and baked to form abaked layer, and a Ni plating treatment and a Sn plating treatment areconducted, whereby Cu baked layer/Ni plating layer/Sn plating layer isformed.

Manufacturing Method of Metal Terminal Portions 30 and 40

In a manufacture of the first metal terminal portion 30, a metal plateis firstly prepared. The metal plate is composed of any conductive metalmaterial, such as iron, nickel, copper, silver, and an alloy thereof.Next, the metal plate is machined to form intermediate members havingshapes of the engagement arm portions 31 a to 33 b, the electrode faceportion 36, the mount portion 38, and the like.

Next, a metal film is formed by plating on the surfaces of theintermediate members formed by machining, and the first metal terminalportion 30 is obtained. Any material, such as Ni, Sn, and Cu, is usedfor the plating. In the plating treatment, a resist treatment against atop surface of the mount portion 38 can prevent the plating fromattaching to the top surface of the mount portion 38. This makes itpossible to generate a difference in solder wettability between the topsurface and the bottom surface of the mount portion 38. Incidentally, asimilar difference can be generated by conducting a plating treatmentagainst the entire intermediate members for formation of a metal filmand removing only the metal film formed on the top surface of the mountportion 38 using a laser exfoliation or so.

Incidentally, in the manufacture of the first metal terminal portions30, a plurality of the first metal terminal portions 30 may be formed ina state of being connected with each other from a metal platecontinuously formed in belt shape. The plurality of the first metalterminal portions 30 is cut into pieces before or after being connectedwith the chip capacitor 20.

The second metal terminal portion 40 is manufactured in a similar mannerto the first metal terminal portion 30.

Assembly of Ceramic Capacitor 10

Two chip capacitors 20 obtained in the above-mentioned manner areprepared and held so that the second side surface 20 d and the firstside surface 20 c are arranged to touch each other. Then, the firstmetal terminal portion 30 and the second metal terminal portion 40 arerespectively attached to the first terminal electrodes 22 and the secondterminal electrodes 24. Moreover, a connection member, such as a solder,is applied to the first through holes of the first and second metalterminal portions 30 and 40, and exists between the electrode faceportions 36 and 46 and the first and second terminal electrodes 22 and24. This allows the first and second metal terminal portions 30 and 40to be electrically and mechanically connected with the first and secondterminal electrodes 22 and 24 of the chip capacitors 20. Then, theceramic capacitor 10 is obtained.

Incidentally, the connection member, such as a solder, may be appliedbeforehand to the electrode face portions 36 and 46 facing the first andsecond terminal electrodes 22 and 24 of the respective first and secondmetal terminal portions 30 and 40 before the first and second metalterminal portions 30 and 40 are attached to the chip capacitors 20, andmay be molten again after the ceramic capacitor 10 is assembled.Incidentally, if necessary, the first and second terminal electrodes 22and 24 and the engagement arm portions 31 a to 33 b and 41 a to 43 aengaged therewith may be adhered to each other by melting a metalplating formed on either or both of their surfaces.

In the ceramic capacitor 10 obtained in this way, a height direction ofthe ceramic capacitor 10 is identical to the direction of the chip firstsides 20 g, which are longer sides of the chip capacitors 20, and themount portions 38 and 48 are formed by being bent from the terminalsecond side toward below the chip capacitors 20. Thus, the ceramiccapacitor 10 has a small projected area in the height direction of theceramic capacitor 10 (see FIG. 4 and FIG. 5), and can have a small mountarea.

In the ceramic capacitor 10, where a plurality of the chip capacitors 20is arranged side by side in the parallel direction to the mount surface,for example, only one chip capacitor 20 is held along an engagementdirection (Z-axis direction) between a pair of the engagement armportions 31 a and 31 b. Thus, the ceramic capacitor 10 has a highconnection reliability between the chip capacitor 20 and the metalterminal portions 30 and 40, and has a high reliability for impact andvibration.

Moreover, since a plurality of the chip capacitors 20 is arranged andlaminated in the parallel direction to the mount surface, the ceramiccapacitor 10 has a short transmission path and can achieve a low ESL.Since the chip capacitors 20 are held vertically to the laminationdirection of the chip capacitors 20, the first and second metal terminalportions 30 and 40 can hold the chip capacitors 20 without any problemseven if the length L2 of the chip second side 20 h of the chipcapacitors 20 varies due to change in the lamination number of the chipcapacitors 20 to be held. Since the first and second metal terminalportions 30 and 40 can hold the chip capacitors 20 having variouslamination numbers, the ceramic capacitor 10 can flexibly respond todesign change.

In the ceramic capacitor 10, the upper arm portions 31 a and 33 a andthe lower arm portions 31 b and 33 b sandwich and hold the chipcapacitors 20 from both ends of the chip first sides 20 g, which arelonger sides of the first end surfaces 20 a of the chip capacitors 20.Thus, the first and second metal terminal portions 30 and 40 caneffectively demonstrate a restraint effect on stress, prevent atransmission of vibration from the chip capacitors 20 to the mountboard, and prevent an acoustic noise. In particular, since the lower armportions 31 b and 33 b are connected with the periphery portions of thesecond through holes 36 c, the lower arm portions 31 b and 33 bsupporting the chip capacitors 20 and the electrode face portions 36 and46 supporting the lower arm portions 31 b and 33 b have an elasticallydeformable shape. Thus, the first and second metal terminal portions 30and 40 can effectively demonstrate a restraint effect on a stressgenerated in the ceramic capacitor 10 and a vibration absorption effect.

Since the lower arm portions 31 b and 33 b are connected with theperiphery portions of the second through holes 36 c, the ceramiccapacitor 10 can arrange the lower arm portions 31 b and 33 b atoverlapped positions with the mount portion 38 when viewed from thevertical direction (Z-axis direction) to the mount surface (see FIG. 5).Thus, the ceramic capacitor 10 can have a wide mount portion 38 and isadvantageous in downsizing.

For example, the ceramic capacitor 10, where the electrode face portion36 is provided with the first through holes 36 b, can definitely connectthe first and second metal terminal portions 30 and 40 and the chipcapacitors 20 by applying a connection member, such as a solder, to thefirst through holes 36 b and forming a solder bridge between theperiphery portions of the first through holes 36 b and the firstterminal electrodes 22. Since the first through holes 36 b are formed, aconnection member, such as a solder, can easily exist between the firstand second terminal electrodes 22 and 24 and the electrode face portions36 and 46 even after the chip capacitors 20 and the first and secondmetal terminal portions 30 and 40 are assembled. Since the first throughholes 36 b are formed, a connection state between the first and secondmetal terminal portions 30 and 40 and the chip capacitors 20 can beeasily recognized from outside, and the ceramic capacitor 10 can therebyhave a reduced quality dispersion and an improved non-defective productratio.

Second Embodiment

FIG. 7 is a schematic perspective view of a ceramic capacitor 100according to Second Embodiment of the present invention. FIG. 8 to FIG.11 are respectively a front view, a left side view, a top view, and abottom view of the ceramic capacitor 100. As shown in FIG. 7, theceramic capacitor 100 is similar to the ceramic capacitor 10 accordingto First Embodiment except that the ceramic capacitor 100 has three chipcapacitors 20 and a different number of first through holes 36 b or socontained in a first metal terminal portion 130 and a second metalterminal portion 140. In the description of the ceramic capacitor 100,similar parts to the ceramic capacitor 10 are provided with similarreferences to the ceramic capacitor 10 and are not described.

As shown in FIG. 7, the chip capacitors 20 contained in the ceramiccapacitor 100 are similar to the chip capacitors 20 contained in theceramic capacitor 10 shown in FIG. 1. The three chip capacitors 20contained in the ceramic capacitor 100 are arranged so that chip firstsides 20 g are vertical to a mount surface as shown in FIG. 8, and thatchip second sides 20 h are parallel to a mount surface as shown in FIG.10. The three chip capacitors 20 contained in the ceramic capacitor 100are arranged in parallel to a mount surface so that the first terminalelectrodes 22 of the chip capacitors 20 adjacent to each other aremutually in contact with, and that the second terminal electrodes 24 ofthe chip capacitors 20 adjacent to each other are mutually in contactwith.

The first metal terminal portion 130 contained in the ceramic capacitor100 has an electrode face portion 136, three pairs of engagement armportions 31 a, 31 b, 33 a, 33 b, 35 a, and 35 b, and a mount portion138. The electrode face portion 136 faces the first terminal electrodes22. The three pairs of engagement arm portions 31 a, 31 b, 33 a, 33 b,35 a, and 35 b hold the chip capacitors 20. The mount portion 138 isbent vertically from a terminal second side 136 hb of the electrode faceportion 136 toward the chip capacitors 20. The electrode face portion136 has a substantially rectangular flat shape, and has a pair ofterminal first sides 136 g approximately parallel to the chip firstsides 20 g and a pair of terminal second sides 136 ha and 136 hbapproximately parallel to the chip second sides 20 h.

As is the case with the first metal terminal portion 30 shown in FIG. 3,the first metal terminal portion 130 is provided with the protrusions 36a, the first through holes 36 b, the second through holes 36 c, and theslits 36 d as shown in FIG. 9. The first metal terminal portion 130 is,however, provided with three each of the first through holes 36 b, thesecond through holes 36 c, and the slits 36 d, and each of the firstthrough holes 36 b, the second through holes 36 c, and the slits 36 dcorresponds with each of the chip capacitors 20. The first metalterminal portion 130 is provided with 12 protrusions 36 a in total, andthe four protrusions 36 a correspond with each of the chip capacitors20.

In the first metal terminal portion 130, as shown in FIG. 10, the upperarm portion 31 a and the lower arm portion 31 b hold one of the chipcapacitors 20, the upper arm portion 33 a and the lower arm portion 33 bhold another one of the chip capacitors 20, and the upper arm portion 35a and the lower arm portion 35 b hold another one of the chip capacitors20 that is different from the above two chip capacitors 20. The upperarm portions 31 a, 33 a, and 35 a are connected with the terminal secondside 136 ha at the upper part of the electrode face portion 136(positive side of the Z-axis direction), and the lower arm portions 31b, 33 b, and 35 b are connected with periphery portions of the secondthrough holes 36 c.

As shown in FIG. 8 and FIG. 11, the mount portion 138 of the first metalterminal portion 130 is connected with the terminal second side 136 hbat the lower part of the electrode face portion 136 (negative side ofthe Z-axis direction). The mount portion 138 extends from the terminalsecond side 136 hb below toward the chip capacitors 20 (negative side ofthe Y-axis direction) and is bent approximately vertically to theelectrode face portion 136.

The second metal terminal portion 140 has an electrode face portion 146,a plurality of pairs of engagement arm portions 41 a, 43 a, and 45 a,and a mount portion 148. The electrode face portion 146 faces the secondterminal electrodes 24. The engagement arm portions 41 a, 43 a, and 45 asandwich and hold the chip capacitors 20 from both ends of the chipfirst sides 20 g in the Z-axis direction. The mount portion 148 extendsfrom the electrode face portion 146 toward the chip capacitors 20 andare at least partially approximately vertical to the electrode faceportion 146.

As is the case with the electrode face portion 36 of the first metalterminal portion 130, the electrode face portion 146 of the second metalterminal portion 140 has a pair of terminal first sides 146 gapproximately parallel to the chip first side 20 g and a terminal secondside 146 ha approximately parallel to the chip second sides 20 h, andthe electrode face portion 146 is provided with the protrusions 46 a,first through holes, second through holes, and slits. As shown in FIG.7, the second metal terminal portion 140 is arranged symmetrically tothe first metal terminal portion 130 and is different from the firstmetal terminal portion 130 in arrangement to the chip capacitors 20. Thesecond metal terminal portion 140 is, however, different from the firstmetal terminal portion 130 only in arrangement and has a similar shapeto the first metal terminal portion 130. Thus, the second metal terminalportion 140 is not described in detail.

The ceramic capacitor 100 according to Second Embodiment has similareffects to those of the ceramic capacitor 10 according to FirstEmbodiment. Incidentally, the number of the upper arm portions 31 a to35 a, the lower arm portions 31 b to 35 b, the first through holes 36 b,the second through holes 36 c, and the slits 36 d contained in the firstmetal terminal portion 130 of the ceramic capacitor 100 is the same asthe number of the chip capacitors 20 contained in the ceramic capacitor100, but the number of the engagement arm portions or so contained inthe ceramic capacitor 100 is not limited thereto. For example, the firstmetal terminal portion 130 may be provided with twice as many firstthrough holes 36 b as the chip capacitors 20, or may be provided with asingle continuous long slit 36 d.

Other Embodiments

The present invention is accordingly described with the embodiments.Needless to say, the present invention is not limited to theabove-mentioned embodiments and includes other variations. For example,the first metal terminal portion 30 shown in FIG. 1 is provided with allof the protrusions 36 a, the first through holes 36 b, the secondthrough holes 36 c, and the slits 36 d, but the present invention is notlimited to having such a first metal terminal portion and also includesa variation of a first metal terminal portion where one or more of theprotrusions 36 a, the first through holes 36 b, the second through holes36 c, and the slits 36 d are not formed.

FIG. 1 to FIG. 11 do not show a connection member connecting between thefirst metal terminal portions 30 and 130 or the second metal terminalportions 40 and 140 and the chip capacitors 20, but the connectionmember has any shape, size, and kind that are appropriately determinedbased on size, usage, and the like of the ceramic capacitors 10 and 100.

FIG. 13 is a left side view showing a ceramic capacitor 300 according toSecond Variation. The ceramic capacitor 300 according to SecondVariation is similar to the ceramic capacitor 10 according to FirstEmbodiment except for the shape of slits 336 d formed on first andsecond metal terminal portions 330. As shown in FIG. 13, the first andsecond metal terminal portions 330 are provided with a single slit 336 dformed below two second through holes 36 c and continuing in the X-axisdirection. The slit 336 d has any shape and number as long as the slit336 d is formed between lower edges (chip second sides 20 h below) ofthe chip capacitors 20 facing the first end surfaces 20 a and theterminal second side 36 hb (i.e., terminal connection part 36 k).

Hereinafter, the present invention is described in detail with Example,but is not limited thereto.

A ceramic capacitor according to Example was measured with respect toinpedance Z and resistance Rs. The ceramic capacitor according toExample has the same shape as the ceramic capacitor 10 shown in FIG. 1.The measurement of inpedance Z and resistance Rs was carried out whilemount portions of the ceramic capacitor was soldered to a mount board.The size of the ceramic capacitor and the measurement conditionsaccording to Example were as below.

Example

<Entire Size of Ceramic Capacitor>

5.0×6.0×6.4 mm

<Chip Component>

Size: (L3×L1×L2) 5.7×5.0×2.5 mm

Capacitance: 15 μF

<Metal Terminals>

Material: three-layer clad material Cu—NiFe—Cu

Size of electrode face portion 36: (Z-axis direction (terminal firstside 36 g)×X-axis direction (terminal second side 36 ha)×platethickness) 6.3×5.0×0.1 mm

Size of arm 33 a: (X direction×Y direction) 0.9×0.9 mm

Size of mount portion: (Y direction) 1.2 mm

<Measurement Conditions>

Frequency: 100 Hz to 10 MHz

Temperature: 25° C.

Comparative Example

A ceramic capacitor according to Comparative Example was measured withrespect to inpedance Z and resistance Rs in a similar manner to Example.As shown in FIG. 14, metal terminals 501 and 502 with L shape are usedin a ceramic capacitor 500 according to Comparative Example. Chipcapacitors 20 of the ceramic capacitor 500 are similar to the chipcapacitors 20 of the ceramic capacitor according to Example. In theceramic capacitor 500, however, the chip capacitors 20 are arranged sothat chip first sides 20 g, which are longer sides of rectanglesconstituting chip end surfaces, are horizontal to a mount surface, andthe two chip capacitors 20 are arranged by being overlapped in avertical direction to the mount surface (Z-axis direction). The chipcapacitors 20 are fixed to electrode face portions 510 of the metalterminals 501 and 502 by a solder.

<Entire Size of Ceramic Capacitor>

5.0×6.0×6.5 mm

<Chip Component>

Same as Example

<Metal Terminals>

Material: three-layer clad material Cu—NiFe—Cu

Size of electrode face portion: (Z-axis direction×X-axis direction×platethickness) 6.3×5.0×0.1 mm

Arm: none

Size of mount portion: (Y direction) 1.6 mm

FIG. 15 shows a graph of inpedance Z and resistance Rs measured usingthe ceramic capacitors according to Example and Comparative Example. Inthe graph shown in FIG. 15, the vertical axis represents inpedance Z andresistance Rs, and the horizontal axis represents frequency. Theimpedance Z measured in the ceramic capacitor according to Example hadone extreme value (minimum value) at resonance points. Meanwhile, theimpedance Z measured in the ceramic capacitor according to ComparativeExample also had other multiple extreme values in a region whosefrequency was higher than that of resonance points. In a region whosefrequency was higher than resonance points where impedance Z wasaffected by ESL, the ceramic capacitor according to Example had smallvalues of impedance Z compared to those of the ceramic capacitoraccording to Comparative Example, and it is understood that the ceramiccapacitor according to Example had a lower ESL compared to that ofComparative Example.

NUMERICAL REFERENCES

-   10, 100 . . . ceramic capacitor-   20 . . . chip capacitor-   20 a . . . first end surface-   20 b . . . second end surface-   20 c . . . first side surface-   20 d . . . second side surface-   20 e . . . third side surface-   20 f . . . fourth side surface-   20 g . . . chip first side-   20 h . . . chip second side-   20 j . . . chip third side-   22 . . . first terminal electrode-   24 . . . second terminal electrode-   26 . . . internal electrode layer-   28 . . . dielectric layer-   30, 130, 40, 140 . . . metal terminal portion-   31 a, 33 a, 35 a, 41 a, 43 a, 45 a . . . upper arm portion    (engagement arm portion)-   31 b, 33 b, 35 b . . . lower arm portion (engagement arm portion)-   36, 136, 46, 146 . . . electrode face portion-   36 a, 46 a . . . protrusion-   36 b . . . first through hole-   36 c . . . second through hole-   36 d, 46 d . . . slit-   36 g . . . terminal first side-   36 ha, 36 hb . . . terminal second side-   38, 138, 48, 148 . . . mount portion

The invention claimed is:
 1. A ceramic electronic device comprising: aplurality of substantially rectangular parallelepiped chip componentsconsisting of a pair of substantially rectangular chip end surfaceshaving a pair of chip first sides and a pair of chip second sides thatare shorter than the chip first sides and tour chip side surfacesconnecting between the pair of chip end surfaces, provided with terminalelectrodes formed on the pair of chip end surfaces, and arranged side byside in a parallel direction to a mount surface; and a pair of metalterminal portions arranged correspondingly with the pair of chip endsurfaces, each of the pair of metal terminal portions comprising: asubstantially rectangular flat electrode face portion having: a pair ofterminal first sides substantially parallel to the chip first sides; apair of terminal second sides substantially parallel to the chip secondsides and facing the chip end surface; a plate body part facing the chipend surfaces; and a terminal connection part positioned below the platebody part, a plurality of pairs of engagement arm portions extendingfrom the electrode face portion toward the chip side surface andsandwiching and holding the chip components from both ends of the chipin a direction that is parallel to the chip first sides vertical to themount surface; a mount portion directly connected to one of the terminalsecond sides of the electrode face portion, extending from the oneterminal second side toward the chip components, and being at leastpartially substantially vertical to the electrode face portion; an upperarm portion that is one of the plurality of engagement arm portions andis connected with the other terminal second side of the electrode faceportion; a lower arm portion that is another one of the plurality ofengagement arm portions and extends from the terminal connection part,the upper arm portion and the lower arm portion sandwiching the chipcomponent from both ends of the terminal first sides; and a secondthrough hole provided in the electrode face portion and whose peripheryportion is connected with the lower arm portion and mounts the platebody part and the terminal connection part, wherein the terminalconnection part connects between the plate body part and the mountportion.
 2. The ceramic electronic device according to claim 1, whereinthe chip components are a multilayer capacitor where internal electrodelayers and dielectric layers are laminated, and the chip components havea lamination direction that is substantially parallel to the chip secondsides.
 3. The ceramic electronic device according to claim 1, wherein afirst through hole is formed in a part of the electrode face portionfacing the chip end surfaces.
 4. The ceramic electronic device accordingto claim 1, wherein the electrode face portion is provided with aplurality of protrusions protruding toward the chip end surfaces andtouching the chip end surfaces.
 5. The ceramic electronic deviceaccording to claim 1, wherein the electrode face portion is providedwith a first through hole the lower arm portion is positioned closer tothe mount portion than the first through hole, and an opening width ofthe second through hole in a width direction that is parallel to theterminal second sides is wider than an opening width of the firstthrough hole in the width direction.
 6. A ceramic electronic devicecomprising; a plurality of substantially rectangular parallelepiped chipcomponents consisting of a pair of substantially rectangular chip endsurfaces having a pair of chip first sides and a pair of chip secondsides that are shorter than the chip first sides and four chip sidesurfaces connecting between the pair of chip end surfaces, provided withterminal electrodes formed on the pair of chip end surfaces, andarranged side by side in a parallel direction to a mount surface; and apair of metal terminal portions arranged correspondingly with the pairof chip end surfaces, each of the pair of metal terminal portionscomprising: a substantially rectangular flat electrode face portionhaving a pair of terminal first sides substantially parallel to the chipfirst sides and a pair of terminal second sides substantially parallelto the chip second sides and facing the chip end surface; a plurality ofpairs of engagement arm portions extending from the electrode faceportion toward the chip side surface and sandwiching and holding thechip components from both ends of the chip in a direction that isparallel to the chip first sides vertical to the mount surface; a mountportion connected with one of the terminal second sides of the electrodeface portion, extending from the one terminal second side toward thechip components, and being at least partially substantially vertical tothe electrode face portion; and a first through hole and a secondthrough hole provided in the electrode face portion, the second throughhole having a periphery portion connected with a lower arm portion thatis one of the plurality of engagement arm portions and positioned closerto the mount portion than the first through hole, wherein an openingwidth of the second through hole in a width direction that is a paralleldirection to the terminal second sides is wider than an opening width ofthe first through hole in the width direction.
 7. A ceramic electronicdevice comprising: a plurality of substantially rectangularparallelepiped chip components consisting of a pair of substantiallyrectangular chip end surfaces having a pair of chip first sides and apair of chip second sides that are shorter than the chip first sides andtour chip side surfaces connecting between the pair of chip endsurfaces, provided with terminal electrodes formed on the pair of chipend surfaces, and arranged side by side in a parallel direction to amount surface; and a pair of metal terminal portions arrangedcorrespondingly with the pair of chip end surfaces, each of the pair ofmetal terminal portions comprising: a substantially rectangular flatelectrode face portion having a pair of terminal first sidessubstantially parallel to the chip first sides and a pair of terminalsecond sides substantially parallel to the chip second sides and facingthe chip end surface; a plurality of pairs of engagement arm portionsextending from the electrode face portion toward the chip side surfaceand sandwiching and holding the chip components from both ends of thechip in a direction that is parallel to the chip first sides vertical tothe mount surface: a mount portion that extends from one of the terminalsecond sides of the electrode face portion toward the chip components,and is at least partially substantially vertical to the electrode faceportion; an upper arm portion that is one of the plurality of engagementarm portions and is connected with the other terminal second side of theelectrode face portion; and a lower arm portion that is another one ofthe plurality of engagement arm portions and extends from the electrode,face portion at a position between the mount portion and the upper armportion.